Temperature-aware routing in 3D ICs

Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Volumn 2006, Issue , 2006, Pages 309-314

  Zhang, Tianpei ^a   Zhan, Yong ^a   Sapatnekar, Sachin S ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; CONGESTION CONTROL (COMMUNICATION); ELECTRIC NETWORK ANALYSIS; HEAT RESISTANCE; INTEGRATED CIRCUITS; ITERATIVE METHODS; MICROPROCESSOR CHIPS; SENSITIVITY ANALYSIS;

CHIP TEMPERATURE; GLOBAL ROUTING ALGORITHMS; THERMAL WIRES; THREE-DIMENSIONAL INTEGRATED CIRCUITS (3D IC);

ROUTERS;

EID: 33748589691     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1118299.1118377     Document Type: Conference Paper

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