Effect of Ce-La mixed rare earth content and environment conditions on the creep rupture life of SnAgCu solder joints

Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering

Volumn 36, Issue 8, 2007, Pages 1473-1476

  Zhang, Keke ^a   Wang, Yaoli ^a   Fan, Yanli ^a   Zhu, Yaomin ^a   Zhang, Xin ^a   Yan, Yanfu ^a  

^a HENAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Creep rupture life; Environment conditions; SnAgCu solder alloy; Solder joints

Indexed keywords

CREEP; INTERMETALLICS; RARE EARTH ELEMENTS; SOLDERED JOINTS;

CREEP RUPTURE LIFE; ENVIRONMENT CONDITIONS; INTERMETALLIC COMPOUND (IMC); SOLDER ALLOY; SOLDER JOINTS;

SOLDERING ALLOYS;

EID: 34948849840     PISSN: 1002185X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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