SCOPUS 정보 검색 플랫폼

Volumn 37, Issue 11, 2008, Pages 1751-1755

In situ scanning electron microscopy observation of tensile deformation in Sn-Ag-Cu alloys containing rare-earth elements

(5) Xiao, Wei Min a Shi, Yao Wu b Lei, Yong Ping b Xia, Zhi Dong b Guo, Fu b

a BEIJING MUNICIPAL INSTITUTE OF LABOUR PROTECTION (China)

b BEIJING UNIVERSITY OF TECHNOLOGY (China)

Author keywords

Deformation mechanism; Fracture; Lead free solder; Rare earth; SEM

Indexed keywords

DEFORMATION MECHANISM; FRACTURE; LEAD-FREE SOLDER; RARE EARTH; SEM;

ALLOYS; CONCENTRATION (PROCESS); COPPER; COPPER ALLOYS; CRYSTAL GROWTH; DEFORMATION; EUTECTICS; GRAIN BOUNDARIES; GRAIN BOUNDARY SLIDING; GRAIN GROWTH; MECHANICAL PROPERTIES; METALLIC COMPOUNDS; MICROSCOPIC EXAMINATION; RARE EARTH ADDITIONS; RARE EARTH ALLOYS; RARE EARTH ELEMENTS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; STRESS CONCENTRATION; TIN ALLOYS;

TIN;

EID: 53149089018 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0532-2 Document Type: Article

Times cited : (6)

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