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Volumn 397, Issue 1-2, 2005, Pages 145-152

Characterization of the shear test method with low melting point In-48Sn solder joints

Author keywords

Finite element analysis; In 48Sn; Pb free solder; Shear height; Shear speed

Indexed keywords

BRITTLENESS; FINITE ELEMENT METHOD; INTERMETALLICS; MELTING; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; TIN;

EID: 17644373440     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.02.040     Document Type: Article
Times cited : (29)

References (24)
  • 9
    • 85161731628 scopus 로고    scopus 로고
    • JESD22-B117, JEDEC Solid State Technology Association
    • JESD22-B117, JEDEC Solid State Technology Association, 2002.
    • (2002)
  • 17
    • 0004093302 scopus 로고    scopus 로고
    • Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
    • New York: McGraw-Hill Inc
    • J.H. Lau Y.H. Pao Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies 1997 McGraw-Hill Inc. New York pp. 91-152
    • (1997) , pp. 91-152
    • Lau, J.H.1    Pao, Y.H.2
  • 23
    • 0003630507 scopus 로고
    • New York: McGraw-Hill Inc pp. 139-144
    • G.E. Dieter Mechanical Metallurgy 1988 McGraw-Hill Inc. New York pp. 139-144, pp. 295-301
    • (1988) Mechanical Metallurgy , pp. 295-301
    • Dieter, G.E.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.