Effect of cerium on wettability and mechanical properties of soldered joints for Sn-Ag-Cu lead free solder

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 26, Issue 10, 2005, Pages 1-4

  Xue, Song Bai ^a   Chen, Yan ^b   Lu, Xiao Chun ^b   Liao, Yong Ping ^b  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b HARBIN WELDING INSTITUTE   (China)

Author keywords

Cerium; Lead free solder; Mechanical properties; Wettability

Indexed keywords

CERIUM; MECHANICAL PROPERTIES; RARE EARTH ADDITIONS; SHEAR STRENGTH; SOLDERED JOINTS; WELDS; WETTING;

LEAD-FREE SOLDER; WETTABILITY;

BRAZING FILLER METALS;

EID: 29244472856     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)