Mechanical strength test method for solder ball joint in BGA package

Metals and Materials International

Volumn 11, Issue 2, 2005, Pages 121-129

  Kim, Jong Woong ^a   Kim, Dae Gon ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Finite element analysis; Shear height; Shear speed; Shear test; Solder

Indexed keywords

BALL GRID ARRAYS; FINITE ELEMENT METHOD; SOLDERED JOINTS; SOLDERING; SPEED; UNIVERSAL JOINTS;

BALL-SHEAR TEST; BRITTLE INTERFACIAL FRACTURE; MICROSTRUCTURAL INVESTIGATION; NON-LINEAR FINITE-ELEMENT ANALYSIS; SHEAR HEIGHT; SHEAR SPEED; SHEAR TESTS; TEST PARAMETERS;

SHEAR FLOW;

EID: 29144463673     PISSN: 15989623     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF03027455     Document Type: Article

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