Investigations of Au/Sn alloys on different end-metallizations for high temperature applications

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1998, Pages 156-165

  Anhock, Sabine ^a   Oppermann, Hermann ^a   Kallmayer, Christine ^a   Aschenbrenner, R ^a   Thomas, Ludwig ^a   Reichl, Herbert ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION IN SOLIDS; ELECTRONICS PACKAGING; GOLD ALLOYS; HIGH TEMPERATURE APPLICATIONS; INTERFACES (MATERIALS); METALLIZING; METALLOGRAPHIC PHASES; MICROELECTRONICS; RELIABILITY; TERNARY SYSTEMS;

GOLD/TIN SOLDERING ALLOYS;

SOLDERING ALLOYS;

EID: 0031635732     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)