Brittle interfacial fracture of PBGA packages soldered on electroless nickel/immersion gold

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 952-961

  Mei, Zequn ^a   Kaufmann, M ^a   Eslambolchi, A ^a   Johnson, P ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; BRITTLE FRACTURE; FRACTURE TESTING; GOLD; GOLD ALLOYS; LEAD-FREE SOLDERS; NETWORK COMPONENTS; NICKEL; AGING OF MATERIALS; ELECTROLESS PLATING; FAILURE ANALYSIS; INTERFACES (MATERIALS); OXIDATION; SOLDERING;

ALTERNATIVE METALS; BRITTLE INTERFACIAL FRACTURE; ELECTROLESS NICKEL; ELECTROLESS NICKEL/IMMERSION GOLDS; ELECTRONIC PRODUCT; FOUR POINT BENDING; INTERFACIAL FRACTURE; PRINTED CIRCUIT BOARDS (PCB);

PRINTED CIRCUIT BOARDS; ELECTRONICS PACKAGING;

FOUR POINT BENDING; PLASTIC BALL GRID ARRAYS (PBGA);

EID: 0031625840     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678824     Document Type: Conference Paper

References (19)

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