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Journal of Electronic Materials

Volumn 35, Issue 1, 2006, Pages 154-164

Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu Pads

(2) Lin, Hsiu Jen a Chuang, Tung Han a

a NATIONAL TAIWAN UNIVERSITY (Taiwan)

Author keywords

Ag Cu pads; Au Ni Cu pads; Ball shear strength; Intermetallic compounds; Sn 9Zn

Indexed keywords

AG/CU PADS; AU/NI/CU PADS; BALL SHEAR STRENGTH; SN-9ZN;

AGING OF MATERIALS; GOLD; INTERMETALLICS; SILVER; SURFACE TREATMENT; THIN FILMS; TIN;

SOLDERING ALLOYS;

EID: 32644450074 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-006-0198-6 Document Type: Conference Paper

Times cited : (11)

References (17)

1
- 0032691904
- N.C. Lee, Adv. Microelectron. 26, 29 (1999).
- (1999) Adv. Microelectron. , vol.26 , pp. 29
- Lee, N.C.¹

2
- 0009054651
- New York: McGraw-Hill Handbooks
- H.J. Lau, C.P. Wong, N.C. Lee, and S.W. Ricky Lee, Electronics Manufacturing with Lead-Free, Halogen-Free & Conductive-Adhesive Materials (New York: McGraw-Hill Handbooks, 2003).
- (2003) Electronics Manufacturing with Lead-Free, Halogen-Free & Conductive-Adhesive Materials
- Lau, H.J.¹ Wong, C.P.² Lee, N.C.³ Ricky Lee, S.W.⁴

3
- 11344254014
- Z. Chen, M. He, and G. Qi, J. Electron. Mater. 33, 1465 (2004).
- (2004) J. Electron. Mater. , vol.33 , pp. 1465
- Chen, Z.¹ He, M.² Qi, G.³

4
- 14044257804
- J.W. Yoon, S.W. Kim, and S.B. Jung, J. Alloys Compounds 391, 82 (2005).
- (2005) J. Alloys Compounds , vol.391 , pp. 82
- Yoon, J.W.¹ Kim, S.W.² Jung, S.B.³

5
- 0036500638
- M.Y. Chiu, S.Y. Chang, Y.H. Tseng, Y.C. Chan, and T.H. Chuang, Z. Metallkd. 93, 248 (2002).
- (2002) Z. Metallkd. , vol.93 , pp. 248
- Chiu, M.Y.¹ Chang, S.Y.² Tseng, Y.H.³ Chan, Y.C.⁴ Chuang, T.H.⁵

6
- 0036471978
- Y.C. Chan, M.Y. Chiu, and T.H. Chuang, Z. Metallkd. 93, 95 (2002).
- (2002) Z. Metallkd. , vol.93 , pp. 95
- Chan, Y.C.¹ Chiu, M.Y.² Chuang, T.H.³

7
- 0036575443
- M.Y. Chiu, S.S. Wang, and T.H. Chuang, J. Electron. Mater. 31, 494 (2002).
- (2002) J. Electron. Mater. , vol.31 , pp. 494
- Chiu, M.Y.¹ Wang, S.S.² Chuang, T.H.³

8
- 0033283977
- P. Harris, Soldering Surf. Mount Technol. 11, 46 (1999).
- (1999) Soldering Surf. Mount Technol. , vol.11 , pp. 46
- Harris, P.¹

9
- 0037370335
- R.K. Shiue, L.W. Tsay, C.L. Lin, and J.L. On, Microelectron. Reliab. 43, 453 (2003).
- (2003) Microelectron. Reliab. , vol.43 , pp. 453
- Shiue, R.K.¹ Tsay, L.W.² Lin, C.L.³ On, J.L.⁴

10
- 0742285758
- T.H. Chuang, H.M. Wu, M.D. Cheng, S.Y. Chang, and S.F. Yen, J. Electron. Mater. 33, 22 (2004).
- (2004) J. Electron. Mater. , vol.33 , pp. 22
- Chuang, T.H.¹ Wu, H.M.² Cheng, M.D.³ Chang, S.Y.⁴ Yen, S.F.⁵

11
- 0036471978
- Y.C. Chan, M.Y. Chiu, and T.H. Chuang, Z. Metallkd. 93, 95 (2002).
- (2002) Z. Metallkd. , vol.93 , pp. 95
- Chan, Y.C.¹ Chiu, M.Y.² Chuang, T.H.³

12
- 0032188151
- K. Suganuma and K. Niihara, J. Mater. Res. 13, 2859 (1998).
- (1998) J. Mater. Res. , vol.13 , pp. 2859
- Suganuma, K.¹ Niihara, K.²

13
- 0042318832
- W.H. Lin and T.H. Chuang, Mater. Eng. Performance 12, 452 (2003).
- (2003) Mater. Eng. Performance , vol.12 , pp. 452
- Lin, W.H.¹ Chuang, T.H.²

14
- 0032207153
- H.M. Lee, S.W. Yoon, and B.J. Lee, J. Electron. Mater. 27, 1161 (1998).
- (1998) J. Electron. Mater. , vol.27 , pp. 1161
- Lee, H.M.¹ Yoon, S.W.² Lee, B.J.³

15
- 0031102543
- S.W. Yoon, J.R. Soh, H.M. Lee, and B.J. Lee, Acta Mater. 45, 951 (1997).
- (1997) Acta Mater. , vol.45 , pp. 951
- Yoon, S.W.¹ Soh, J.R.² Lee, H.M.³ Lee, B.J.⁴

16
- 0033534274
- S.W. Yoon, W.K. Choi, and H.M. Lee, Scripta Mater. 40, 327 (1999).
- (1999) Scripta Mater. , vol.40 , pp. 327
- Yoon, S.W.¹ Choi, W.K.² Lee, H.M.³

17
- 35949026593
- F.H. Huang and H.B. Huntington, Phys. Rev. B9 1479 (1974).
- (1974) Phys. Rev. , vol.B9 , pp. 1479
- Huang, F.H.¹ Huntington, H.B.²

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