Interfacial fracture mechanism of BGA packages on electroless Ni / Au

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1543-1550

  Mei, Z ^a   Callery, P ^a   Fisher, D ^a   Hua, F ^a   Glazer, J ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000019777     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)

1. Wolfgang Riedel, Electroless Nickel Plating, ASM International, Metals Park, Ohio, USA.
2. E. Bradley and K. Banerji, "Effect of PCB finish on the reliability and wettability of BGA packages", ECTC conf proceeding, 1995, pp. 1028-1030; and E. Bradley, lecture in Ninth Annual Soldering Symposium, SUNY-Binghamton, Oct. 21, 1996.
3. E. Bradley and K. Banerji, "Effect of PCB finish on the reliability and wettability of BGA packages", ECTC conf proceeding, 1995, pp. 1028-1030; and E. Bradley, lecture in Ninth Annual Soldering Symposium, SUNY-Binghamton, Oct. 21, 1996.
4. K. Puttlitz, "Preparation, structure, and fracture modes of Pb-Sn and Pb-In terminated flip-chip attached to gold capped microsockets", IEEE Trans-CHMT, vol. 13, 1990, p. 647-655.
5. V. F. Hribar, J. L. Bauer, T.P. O'Donnell, "Microstructure of electroless nickel-solder interactions," 3rd International SAMPE Electronics Conf., June 20-22, 1989, pp. 1187-1199.
6. Smithells Metals Reference Book, Sixth Edition, Editor E. A. Brandes, Butterworths.
7. A.H. Graham, R.W. Lindsay, and H.J. Read, "the structure and mechanical properties of electroless nickel," J. of the Electrochemical Society, April 1965, pp. 401-413.
8. C-Y. Lee and K-L. Lin, "the interaction kinetics and compound formation between electroless Ni-P and solder," Thin Solid Films, vol. 249 (1994), pp. 201-206.
9. William O. Rogers, Motorola, "Method for enhancing the solderability of nickel layers", United States Patent 4603805, Aug. 5, 1986.
10. K-L. Lin and J-M. Jang, "Wetting behavior between solder and electroless nickel deposits", Materials Chemistry and Physics, vol. 38, 1994, pp. 33-41.
11. Pearson's Handbook of Crystallographic Data for Intel-metallic Phases, ASM, Metals Park, OH.
12. D.R. Frear, F.M. Hosking, and P.T. Vianco, "Mechanical behavior of solder joint interfacial intermetallics", Materials Developments in Microelectronic Packaging Conf Proceeding, Montreal, Quebec, Canada, August 19-22, 1991, pp. 229-240.
13. C-Y. Lee and K-L. Lin, "Materials interaction in Pb-Sn/Ni-P/Al and Pb-Sn/Ni-B/Al solder bumps on chips," Thin Solid Films, vol. 229 (1993), pp. 63-75.