Characterization of interfacial reaction layers formed between Sn-3.5Ag solder and electroless Ni-immersion Au-plated Cu substrates

Journal of Electronic Materials

Volumn 37, Issue 1, 2008, Pages 84-89

  Kang, Han Byul ^a   Bae, Jee Hwan ^a   Lee, Jae Wook ^a   Park, Min Ho ^a   Yoon, Jeong Won ^a   Jung, Seung Boo ^a   Yang, Cheol Woong ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Electroless nickel immersion gold; Solder; Transmission electron microscopy

Indexed keywords

ELECTROLESS NICKEL; IMMERSION GOLD;

ELECTROLESS PLATING; GOLD; REACTION KINETICS; SURFACE CHEMISTRY; TRANSMISSION ELECTRON MICROSCOPY;

SOLDERING ALLOYS;

EID: 37249087939     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0262-x     Document Type: Article

References (24)

1. K. Zeng and K.N. Tu, Mater. Sci. Eng. R. 38, 55 (2002).
2. M. Abtew and G. Selvaduray, Mater. Sci. Eng. R. 27, 95 (2000).
3. J.W. Yoon, S.W. Kim, and S.B. Jung, Mater. Trans. 45, 727 (2004).
4. K. Suganuma, Curr. Opin. Solid State Mater. Sci. 5, 55 (2001).
5. J.W. Yoon, S.W. Kim, J.M. Koo, D.G. Kim, and S.B. Jung, J. Electron. Mater. 33, 1190 (2004).
6. J.W. Yoon and S.B. Jung, J. Mater. Res. 21, 1590 (2006).
7. J.W. Yoon, J.H. Lim, H.J. Lee, J. Joo, W.C. Moon, and S.B. Jung, J. Mater. Res. 21, 3196 (2006).
8. M.N. Islam, Y.C. Chan, and A. Sharif, J. Mater. Res. 19, 2897 (2004).
9. W.C. Luo, C.E. Ho, J.Y. Tsai, Y.L. Lin, and C.R. Kao, Mater. Sci. Eng., A 396, 385 (2005).
10. C.H. Wang and S.W. Chen, Acta Mater. 54, 247 (2006).
11. S.W. Kim, J.W. Yoon, and S.B. Jung, J. Electron. Mater. 33, 1182 (2004).
12. J.W. Jang, D.R. Frear, T.Y. Lee, and K.N. Tu, J. Appl. Phys. 88, 6359 (2000).
13. S.J. Wang and C.Y. Liu, Scripta Mater. 49, 813 (2003).
14. A. Sharif, M.N. Islam, and Y.C. Chan, Mater. Sci. Eng., B 113, 184 (2004).
15. Y.C. Lin and J.G. Duh, Scripta Mater. 54, 1661 (2006).
16. Y.C. Lin, T.Y. Shih, S.K. Tien, and J.G. Duh, Scripta Mater. 56, 49 (2007).
17. N. Torazawa, S. Arai, Y. Takase, K. Sasaki, and H. Saka, Mater. Trans. 44, 1438 (2003).
18. H. Matsuki, H. Ibuka, and H. Saka, Sci. Technol. Adv. Mater. 3, 261 (2002).
19. V. Vuorinen, T. Laurila, H. Yu, and J.K. Kivilahti, J. Appl. Phys. 99, 023530 (2006).
20. C.W. Hwang, K. Suganuma, M. Kiso, and S. Hashimoto, J. Mater. Res. 18, 2540 (2003).
21. C.B. Lee, S.B. Jung, and Y.E. Shin, C.C. Shur, Mater. Trans. 43, 1858 (2002).
22. J.W. Yoon and S.B. Jung, Mater. Sci. Forum. 510-511, 554 (2006).
23. J.W. Jang, P.G. Kim, K.N. Tu, D.R. Frear, and P. Thompson, J. Appl. Phys. 85, 8456 (1999).
24. T.B. Massalski, Binary Alloy Phase Diagrams (Metals Park, OH: ASM International, 1987) pp. 2833-2837.