ITRI project on electroless nickel/immersion gold joint cracking

Circuit World

Volumn 26, Issue 2, 2000, Pages 10-16

  Houghton, F D Bruce ^a  

^a Celestica Inc   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; ELECTRODES; FAILURE ANALYSIS; FINISHING; GOLD; NICKEL; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUIT TESTING; SOLDERED JOINTS; STRESS ANALYSIS;

ELECTROLESS FINISHING;

PRINTED CIRCUIT BOARDS;

EID: 0033688226     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120010310882     Document Type: Article

References (3)

1. Cordes, F. and Huemoeller, R. (1998), "Electroless nickel-gold; is there a future? Electroless Ni/Au plating capability study of BGA packages", Future Circuits, Vol. 3, December.
2. Mei, Z. (1998), "The effect of electroless Ni/immersion Au plating parameters on PBGA solder joint attachment reliability", IPC National Conference Proceedings: A Summit on PWB Surface Finishes and Solderability, 22-23 September, Austin, TX, pp. 19-42.
3. Mei, Z., Kaufmann, M. and Johnson, P. (1997), "Interfacial fracture of BGA packages on electroless Ni/immersion Au and its relation to plating process", IPC National Conference Proceedings: A Summit on PWB Surface Finishes and Solderability, 22-23 September, Bloomington, MN, pp. 23-45.