Chemically capping copper with cobalt

Microelectronic Engineering

Volumn 87, Issue 4, 2010, Pages 588-592

  Henderson, Lucas B ^a   Ekerdt, John G ^a  

^a The University of Texas at Austin   (United States)

Author keywords

Chemical vapor deposition; Cobalt alloys; Selective deposition

Indexed keywords

C INCORPORATION; CHIP FABRICATION; COPPER PHOSPHIDE; FILM PROPERTIES; FREE SURFACES; HIGH REACTIVITY; PEEL TESTS; SELECTIVE DEPOSITION; TRIMETHYLPHOSPHINES; TWO-MATERIALS;

ALLOYS; CHEMICAL VAPOR DEPOSITION; COBALT; COBALT ALLOYS; COPPER; DEPOSITION; PHOSPHORUS; SILICON COMPOUNDS;

COPPER ALLOYS;

EID: 75149154153     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.08.017     Document Type: Article

References (51)

1. Save D., Braud F., Torres J., Binder F., Müller C., Weidner J.O., and Hasse W. Microelectron. Eng. 33 (1997) 75
2. Hu C.-K., Gignac L., and Rosenberg R. Microelectron. Reliab. 46 (2006) 213
3. Li B., Sullivan T.D., Lee T.C., and Badami D. Microelectron. Reliab. 44 (2004) 365
4. Lloyd J.R., and Clement J.J. Thin Solid Films 262 (1995) 135
5. Lane M.W., Liniger E.G., and Lloyd J.R. J. Appl. Phys. 93 (2003) 1417
6. Lin M.H., Lin Y.L., Chen J.M., Yeh M.-S., Chang K.P., Su K.C., and Wang T. IEEE Trans. Electron. Dev. 52 (2005) 2602
7. Yi S.-M., Shim C., Lee H.-C., Han J.-W., Kim K.-H., and Joo Y.-C. Microelectron. Eng. 85 (2008) 621
8. Michael N.L., Kim C.-U., Jiang Q.-T., Augur R.A., and Gillespie P. J. Electron. Mater. 31 (2002)
9. Kim H., Naito Y., Koseki T., Ohba T., Ohta T., Kojima Y., Sato H., and Shimogaki Y. Jpn. J. Appl. Phys. 45 (2006) 2497
10. International Technology Roadmap for Semiconductors, http://public.itrs.net, 2008 (accessed 16.04.09).
11. Sheikholeslam M.A., Enayati M.H., and Raeissi K. Mater. Lett. 62 (2008) 3629
12. Dulal S.M.S.I., Yun H.J., Shin C.B., and Kim C.-K. J. Electrochem. Soc. 154 (2007) D494
13. Tarozaitė R., Kurtinaitienė M., Džiūvė A., and Jusys Z. Surf. Coat. Technol. 115 (1999) 57
14. Gambino J., Wynne J., Gill J., Mongeon S., Meatyard D., Lee B., Bamnolker H., Hall L., Li N., Hernandez M., Little P., Hamed M., Ivanov I., and Gan C.L. Microelectron. Eng. 83 (2006) 2059
15. Li Z., Gordon R.G., Farmer D.B., Lin Y., and Vlaasak J. Electrochem. Solid State Lett. 8 (2005) G182
16. Singer P. Semicond. Int. 28 (2005) 44
17. Shacham-Diamand Y., Dedhia A., Hoffstetter D., and Oldham W.G. J. Electrochem. Soc. 140 (1993) 2427
18. Lanckmans F., and Maex K. Microelectron. Eng. 60 (2002) 125
19. Lloyd J.R., Murray C.E., Ponoth S., Cohen S., and Liniger E. Microelectron. Reliab. 46 (2006) 1643
20. Aw K.C., Salim N.T., Gao W., and Prince K. Int. J. Mod. Phys. B 20 (2006) 4165
21. Chow K.M., Ng W.Y., and Yeung L.K. Surf. Coat. Tech. 99 (1998) 161
22. Paunovic M., Bailey P.J., and Schad R.G. J. Electrochem. Soc. 141 (1994) 1843
23. O'Sullivan E.J., Schrott A.G., Paunovic M., Sambucetti C.J., Marino J.R., Bailey P.J., Kaja S., and Semkow K.W. IBM J. Res. Dev. 42 (1998) 607
24. Kohn A., Eizenberg M., and Shacham-Diamand Y. J. Appl. Phys. 94 (2003) 3015
25. Decorps T., Haumesser P.H., Olivier S., Roule A., Joulaud M., Pollet O., Avale X., and Passemard G. Microelectron. Eng. 83 (2006) 2082
26. Chang S.Y., Wan C.C., and Wang Y.Y. Electrochem. Solid State Lett. 10 (2007) D43
27. Henderson L.B., and Ekerdt J.G. Electrochem. Solid State Lett. 12 (2009) D36
28. L.B. Henderson, J.G. Ekerdt, J. Electrochem. Soc. submitted for publication.
29. ASTM D 3359-08, Standard Test Methods for Measuring Adhesion by Tape Test, ASTM International, West Conshohocken, PA, USA, 2008.
30. Okamoto H. Cu-P phase diagram. In: Villars P. (Ed). ASM Alloy Phase Diagrams Center (2006), ASM International, Materials Park, OH. (accessed 02.05.09)
31. NIST, X-ray Photoelectron Spectroscopy Database. Vers. 3.5, National Institute of Standards and Technology, Gaithersburg, MD. , 2003 (accessed 02.05.09).
32. Taglauer E., and Heiland W. Appl. Phys. 9 (1976) 261
33. NIST, Electron Effective-Attenuation-Length Database, Vers. 1.0, National Institute of Standards and Technology, Gaithersburg, MD, 2001.
34. J. Shin, D. Gay, Y.-M. Sun, J.M. White, J.G. Ekerdt, AIP Conf. Proc. 788 (2005) 482.
35. Skriver H.L., and Rosengard N.M. Phys. Rev. B 46 (1992) 7157-7168
36. Shin J., Kim H.-W., Hwang G.S., and Ekerdt J.G. Surf. Coat. Technol. 201 (2007) 9526
37. Staszczuk P., Jańczuk B., and Chibowski E. Mater. Chem. Phys. 12 (1985) 469
38. Henderson L.B., and Ekerdt J.G. Thin Solid Films 517 (2009) 1645
39. Maex K., Baklanov M.R., Shamiryan D., Iacopi F., Brongersma S.H., and Yanovitskaya Z.S. J. Appl. Phys. 93 (2003) 8793
40. Shamiryan D., Abell T., Iacopi F., and Maex K. Mater. Today 7 (2004) 34
41. Treichel H. J. Electron. Mater. 30 (2001) 290
42. Hatton B.D., Landskron K., Hunks W.J., Bennett M.R., Shukaris D., Perovic D.D., and Ozin G.A. Mater. Today 9 (2006) 22
43. Lane M., Dauskardt R., Krishna N., and Hashim I. Mater. Res. Soc. Symp. Proc. 564 (1999) 281
44. Lai Y.-H., Yeh C.-T., Lin H.-J., Chen C.-T., and Hung W.-H. J. Phys. Chem. B 106 (2002) 1722
45. Shin J., Kim H.-W., Agapiou K., Jones R.A., Hwang G.S., and Ekerdt J.G. J. Vac. Sci. Technol. A 26 (2008) 974
46. Goncharova L.V., Clowes S.K., Fogg R.R., Ermakov A.V., and Hinch B.J. Surf. Sci. 515 (2002) 553
47. Gross M.E., Schnoes Kranz K., Brasen D., and Luftman H. J. Vac. Sci. Technol. B 6 (1988) 1548
48. Ye D.-X., Pimanpang S., Jezewski C., Tang F., Senkevich J.J., Wang G.-C., and Lu T.-M. Thin Solid Films 485 (2005) 95
49. Zhao Q., Greve D.W., and Barmak K. Appl. Surf. Sci. 219 (2003) 136
50. E. Nakazawa, K. Arita, Y. Tsuchiya, Y. Kakuhara, S. Yokogawa, T. Kurokawa, N. Sasaki, S. Ganguli, H.-C. Ha, W.T. Lee, S.-H. Yu, M. Sekine, in: M. Naik, R. Shaviv, T. Yoda, K. Ueno (Eds.), Proceedings of the Advanced Metallization Conference, San Diego, USA, September 23-25, 2008, p. 19.
51. Yang H.J., Lee J., Kim S., Ko Y.K., Shin H.J., Lee J.G., Kim C., Bang H.J., Cho B.S., Bae Y.H., Lee J.H., Kim D.H., Jeong C.O., Kim S.Y., and Lim S.K. J. Appl. Phys. 100 (2006) 113705-1