Growth and characterization of ultrathin metal films for ULSI interconnects

AIP Conference Proceedings

Volumn 788, Issue , 2005, Pages 482-487

  Shin, J ^a   Gay, D ^a   Sun, Y M ^a   White, J M ^a   Ekerdt, J G ^a  

^a The University of Texas at Austin   (United States)

Author keywords

Chemical Vapor Deposition; Ion Scattering Spectroscopy; Ruthenium; X ray Photoelectron Spectroscopy

Indexed keywords

EID: 33749676245     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2063006     Document Type: Conference Paper

References (17)

1. Wang, Q., Ekerdt, J. G., Gay, D., Sun, Y.-M., and White, J. M., Appl. Phys. Letters 84, 1380-1382 (2004).
2. Goswami, I., and Laxman, R., Semiconductor International 27(5), 49-54 (2004).
3. Chyan, O., Arunagiri, T. N., and Ponnuswamy, T., J. Electrochem. Soc. 150, C347-C350 (2003).
4. Rossnagel, S., Solid State Technology, February 2005 Exclusive online feature #1: Deposition, www.solid-state.com 01-04 (2005).
5. Kwon, O, Kim, J., Park, H., Kang, S., J. Electrochem. Soc. 151,G109-G112 (2004).
6. Aaltonen, T., Alen, P., Ritala, H., Leskela, M., Chem. Vap. Dep. 9, 45-49 (2003).
7. Lashdaf, M, Hatanpää, T., Krause, A. O. I., Lahtinen, J., Lindblad, M., and Tiitta, M., Applied Catalysis A: General 241, 51-63 (2003).
8. Lu, T-M., and Senkevich, J. J., Worldwide Patten Application Number WO2004035858 (2004).
9. Yubero, F., González-Elipe, A. R., and Tougaard, S., Surf. Sci. 457, 24-36 (2000).
10. Tougaard, S., J. Vac. Sci. Technol. A 14 1415-1423 (1996).
11. Jiménez, V. M., Espinós, J. P., and González-Elipe, A. R., Appl. Surf. Sci. 141, 186-192 (1999).
12. Nelson, G. C., J. Appl. Phys. 47, 1253-1255 (1976).
13. Sun, Y-M., Lee, S. Y., Lemonds, A. M., Engbrecht, E. R., Veldman, S., Lozano, J., White, J. M., Ekerdt, J. G., Emesh, I., and Pfeifer, K., Thin Solid Films 397, 109-115 (2001).
14. Wach, I. E., Characterization of Catalytic Materials, Boston, Butterworth-Heinemann, 1992, pp 172.
15. Kwak, M. Y., Shin, D. H., Kang, T. W., and Kim, K. N., Thin Solid Films 339 290-293 (1999).
16. Rha, S.K., Lee, W. J., Lee,. S. Y., Hwang, Y. S., Lee, Y. J., Kim, D. I., Kim, D. W., Chun, S. S., and Park, C. O., Thin Solid Films 320, 134-140 (1998).
17. Kizil, H., and Steinbrüchel, C., Thin Solid Films 449, 158-165 (2004).