Electrolessly deposited diffusion barriers for microelectronics

IBM Journal of Research and Development

Volumn 42, Issue 5, 1998, Pages 607-619

  O'Sullivan, E J ^a   Schrott, A G ^a   Paunovic, M ^a   Sambucetti, C J ^a   Marino, J R ^a   Bailey, P J ^a   Kaja, S ^a   Semkow, K W ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COBALT; COPPER; ELECTROLESS PLATING; INTERDIFFUSION (SOLIDS); NICKEL; PLASTIC FILMS; POLYIMIDES; SCANNING ELECTRON MICROSCOPY; X RAY ANALYSIS;

DIFFUSION BARRIER LAYERS;

MICROELECTRONIC PROCESSING;

EID: 0032166446     PISSN: 00188646     EISSN: None     Source Type: Journal    
DOI: 10.1147/rd.425.0607     Document Type: Article

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