Study of copper diffusion in low-k thin film using sims

International Journal of Modern Physics B

Volumn 20, Issue 25-27, 2006, Pages 4165-4170

  Aw, K C ^a   Salim, N T ^a   Gao, Ewi ^a   Prince, K ^b  

^a UNIVERSITY OF AUCKLAND   (New Zealand)

^b AUSTRALIAN NUCLEAR SCIENCE AND TECHNOLOGY ORGANISATION   (Australia)

Author keywords

Cu diffusion; Low k dielectric; Thermal activation energy

Indexed keywords

EID: 33751282438     PISSN: 02179792     EISSN: None     Source Type: Journal    
DOI: 10.1142/s0217979206041033     Document Type: Conference Paper

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