Interdiffusion of Cu substrate/electrodeposits for Cu/Co, Cu/Co-W, Cu/Co/Ni and Cu/Co-W/Ni systems

Surface and Coatings Technology

Volumn 99, Issue 1-2, 1998, Pages 161-170

  Chow, K M ^a   Ng, W Y ^a   Yeung, L K ^b  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b Hong Kong Productivity Council   (Hong Kong)

Author keywords

Cobalt; Diffusion barrier; Nickel; Tungsten

Indexed keywords

EID: 0000866694     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(97)00524-0     Document Type: Article

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