Nucleation and adhesion of ALD copper on cobalt adhesion layers and tungsten nitride diffusion barriers

Electrochemical and Solid-State Letters

Volumn 8, Issue 7, 2005, Pages

  Li, Zhengwen ^a   Gordon, Roy G ^a   Farmer, Damon B ^b   Lin, Youbo ^b   Vlassak, Joost ^b  

^a HARVARD UNIVERSITY   (United States)

^b HARVARD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; CHEMICAL VAPOR DEPOSITION; COBALT; DEPOSITION; DIFFUSION; NANOSTRUCTURED MATERIALS; NUCLEATION; RUTHERFORD BACKSCATTERING SPECTROSCOPY; TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN COMPOUNDS;

ATOMIC LAYER DEPOSITION (ALD); COBALT ADHESION LAYERS; DIFFUSION BARRIERS; ELECTRICAL INTERCONNECTIONS;

COPPER;

EID: 23244463337     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1924929     Document Type: Article

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