The effect of Bi on the IMC growth in Sn-3Ag-0.5Cu solder interface during aging process

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability

Volumn , Issue , 2004, Pages 42-46

  Qi, Lin ^a   Zhao, Jie ^a   Wang, Xiu Min ^a   Wang, Lai ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Aging; IMC layer; Microstructure evolution; Solder joint

Indexed keywords

AGING OF MATERIALS; COPPER; DIFFUSION; ISOTHERMS; MELTING; MICROSTRUCTURE; SILVER; SOLDERED JOINTS; TIN ALLOYS;

MELTING POINTS; STANDARD ALLOY SYSTEMS; THERMAL AGING; THICKENING PROCESS;

SOLDERING ALLOYS;

EID: 4544388266     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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