Effects of interfacial IMC on tensile fracture behavior of Sn-3.0Ag-0.5Cu solder joints on copper substrates

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 17, Issue 12, 2007, Pages 1936-1942

  Ju, Guo Kui ^a   Wei, Xi Cheng ^a   Sun, Peng ^a,b   Liu, Johan ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

Cu Sn 3.0Ag 0.5Cu Cu joint; Intermetallic compound (IMC); Kirkendall void; Multilayer structure; Tensile fracture

Indexed keywords

CHEMICAL ANALYSIS; COPPER ALLOYS; FRACTURE TOUGHNESS; MORPHOLOGY; MULTILAYERS; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; TIN ALLOYS;

COMPOSITION; FRACTURE STRENGTH; INTERMETALLIC COMPOUND (IMC); KIRKENDALL VOID; MULTILAYER STRUCTURE; SOLDER JOINTS; TENSILE FRACTURE;

INTERMETALLICS;

EID: 38649117922     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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