Growth behavior of intermetallic compounds on Sn-3.5Ag-0.5Cu/Cu (Ni) interface under thermal-shearing cycling condition

Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering

Volumn 36, Issue 2, 2007, Pages 241-244

  Qi, Lihua ^a   Huang, Jihua ^a   Zhang, Jiangang ^a   Wang, Ye ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Interface; Intermetallic compounds (IMC); Sn 3.5Ag 0.5Cu solder; Thermal shearing cycling

Indexed keywords

GROWTH KINETICS; INTERFACES (MATERIALS); MORPHOLOGY; SHEARING; SOLDERING ALLOYS;

INTERMETALLIC COMPOUNDS (IMC); THERMAL SHEARING CYCLING;

INTERMETALLICS;

EID: 34147137977     PISSN: 1002185X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. Young-Sun Kim et al. Journal of Alloys and Compounds[J]. 2003, (352): 237
2. Kyung-Seob Kim et al. Journal of Alloys and Compounds[J]. 2004, (379): 314
3. Xin Ma et al. Materials Letters[J]. 2003, (57): 3361
4. Tu K N et al. Materials Science and Engineering[J]. 2001, R34: 1
5. Qin Lin et al. Electronic Process Technology[J]. 2004, 25(2): 64
6. Tu P L, Chan Y C, Lai J K L. IEEE Trans Comp Pack Manufact Technol B[J]. 1997, 20(1): 87
7. Ahmed Sharif, Islam M N, Chan Y C. Materials Science and Engineering B[J]. 2004, 113: 184