A methodology for fatigue prediction of electronic components under random vibration load

Journal of Electronic Packaging

Volumn 123, Issue 4, 2001, Pages 394-400

  Li, Ron S ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0012984451     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1372318     Document Type: Article

References (17)

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