Study on solder joint reliability of ceramic ball grid array component based on design of experiment method

China Welding (English Edition)

Volumn 15, Issue 3, 2006, Pages 68-73

  Wu, Zhaohua ^a   Huang, Chunyue ^a   Zhou, Dejian ^a  

^a GUILIN UNIVERSITY OF ELECTRONIC TECHNOLOGY   (China)

Author keywords

Ceramic ball grid array; Design of experiment; Finite element analysis; Process parameters; Solder joint

Indexed keywords

CERAMIC MATERIALS; COMPONENTS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; RELIABILITY;

BALL DIAMETER; CERAMIC BALL GRID ARRAY; FINITE ELEMENT ANALYSIS; PAD DIAMETER; PROCESS PARAMETERS; SOLDER JOINT; STAND-OFF; STENCIL THICKNESS; THERMAL FATIGUE LIFE;

SOLDERED JOINTS;

EID: 33845522046     PISSN: 10045341     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

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