SMT solder joint's semi-experimental fatigue model

Mechanics Research Communications

Volumn 32, Issue 3, 2005, Pages 351-358

  Guo, Qiang ^a   Zhao, Mei ^a   Wang, Hongfang ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Fatigue; Random vibration; SMT solder joint

Indexed keywords

AUTOMATION; COSTS; FATIGUE OF MATERIALS; PRINTED CIRCUIT BOARDS; RELIABILITY; SEMICONDUCTOR DEVICES; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING;

DYNAMIC LOADING EFFECTS; HIGH-DENSITY ELECTRONIC ASSEMBLIES; RANDOM VIBRATION; RANDOM VIBRATION THEORY;

SOLDERED JOINTS;

EID: 13444292284     PISSN: 00936413     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mechrescom.2004.03.011     Document Type: Article

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