Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading

Circuit World

Volumn 24, Issue 3, 1998, Pages 26-31

  Lee, Shi Wei Ricky ^a   Zhang, Xiaowu ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELASTOPLASTICITY; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SENSITIVITY ANALYSIS; STRAIN; STRESS ANALYSIS; THERMAL EFFECTS; VISCOPLASTICITY;

COFFIN-MANSON EQUATIONS; NORTON'S EQUATIONS; PLASTIC QUAD FLAT PACK (PQFP);

SOLDERING ALLOYS;

EID: 0032048931     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056129810208438     Document Type: Article

References (9)

1. Darveaux, R. and Banerji, K. (1992), "Constitutive relations for tin-based solder joints", IEEE Transactions on CHMT, Vol. 15, pp. 1013-24.
2. Dasgupta, A. et al. (1992), "Solder creep fatigue analysis by an energy partitioning approach", Journal of Electronic Packaging, Vol. 114, pp. 152-60.
3. Engelmaier, W. (1983), "Fatigue life of leadless chip carrier solder joints during power cycling", IEEE Transactions on CHMT, Vol. 6, pp. 232-7.
4. Govila, R.K. et al. (1994), "Failure analysis of no-clean and water-clean solder joints, 0.4mm pitch, 256-pin, PQFP", Journal of Electronic Packaging, Vol. 116, pp. 184-90.
5. Lau, J.H. (1991), Solder Joint Reliability: Theory and Applications, Van Nostrand Reinhold, New York, NY.
6. Pao, Y.H. (1992), "A fracture mechanics approach to thermal fatigue life prediction of solder joints", IEEE Transactions on CHMT, Vol. 15, pp. 559-70.
7. Pao, Y.H. et al. (1992), "Measurement of mechanical behavior of high lead lead-tin solder joints subjected to thermal cycling", Journal of Electronic Packaging, Vol. 114, pp. 135-44.
8. Pao, Y.H. et al. (1994), "Thermomechanical and fatigue behavior of high-temperature lead and lead-free solder joints", ASTM STP, Vol. 1153, pp. 60-81.
9. Solomon, H.D. (1986), "Fatigue of 60Sn/40Pb solder", IEEE Transactions on CHMT, Vol. 9, pp. 423-32.