Thermal runaway in integrated circuits

IEEE Transactions on Device and Materials Reliability

Volumn 6, Issue 2, 2006, Pages 300-305

  Vassighi, Arman ^a,b   Sachdev, Manoj ^a,c  

^a IEEE   (Canada)

^b INTEL CORPORATION   (United States)

^c UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Integrated circuits (ICs); Microprocessor; Thermal runaway

Indexed keywords

JUNCTION TEMPERATURE; THERMAL MANAGEMENT; THERMAL RUNAWAY;

LEAKAGE CURRENTS; MICROPROCESSOR CHIPS; SEMICONDUCTOR JUNCTIONS; THERMAL EFFECTS;

INTEGRATED CIRCUITS;

EID: 33748095941     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2006.876577     Document Type: Conference Paper

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