Enhancement of filling performance of a copper plating formula at low chloride concentration

Electrochimica Acta

Volumn 53, Issue 10, 2008, Pages 3610-3619

  Dow, Wei Ping ^a   Yen, Ming Yao ^a   Liu, Cheng Wei ^b   Huang, Chen Chia ^b  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Chloride concentration; Copper electroplating; Filling; Leveler; Microvia

Indexed keywords

CHLORIDE MINERALS; CONCENTRATION (PROCESS); ELECTROCHEMISTRY; ELECTROPLATING; FILLING; POLYETHYLENE GLYCOLS;

CHLORIDE CONCENTRATION; COPPER ELECTROPLATING;

COPPER;

EID: 39149125112     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2007.12.048     Document Type: Article

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