Interactions between brightener and chloride ions on copper electroplating for laser-drilled via-hole filling

Electrochemical and Solid-State Letters

Volumn 6, Issue 9, 2003, Pages

  Dow, Wei Ping ^a   Huang, Her Shu ^a   Lin, Zack ^b  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b Unicap Electron Indust Corporation   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROPLATING; GROWTH (MATERIALS); LASER ABLATION; POLYETHYLENE GLYCOLS; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY;

FILLING BEHAVIOR;

CHLORINE COMPOUNDS;

EID: 0042417240     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1595311     Document Type: Article

References (25)

1. P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans, and H. Deligianni, IBM J. Res. Dev., 42, 567 (1998).
2. T. Kobayashi, J. Kawasaki, K. Mihara, and H. Honma, Electrochim. Acta, 47, 85 (2001).
3. H. Xiao, Introduction to Semiconductor Manufacturing Technology, p. 494, Prentice-Hall Inc., Englewood Cliffs, NJ (2001).
4. J. J. Kelly and A. C. West, Electrochem. Solid-State Lett., 2, 561 (1999).
5. T. P. Moffat, J. E. Bonevich, W. H. Huber, A. Stanishevsky, D. R. Kelly, G. R. Stafford, and D. Josell, J. Electrochem. Soc., 147, 4524 (2000).
6. P. Taephaisitphongse, Y. Cao, and A. C. West, J. Electrochem. Soc., 148, C492 (2001).
7. J. Reid, Jpn. J. Appl. Phys., Part 1, 40, 2650 (2001).
8. T. Haba, T. Itabashi, H. Akahoshi, A. Sano, K. Kobayashi, and H. Miyazaki, Mater. Trans., JIM, 43, 1593 (2002).
9. T. P. Moffat, D. Wheeler, C. Witt, and D. Josell, Electrochem. Solid-State Lett., 5, C110 (2002).
10. T. Reid, S. Mayer, E. Broadbent, E. Klawuhn, and K. Ashtiani, Solid State Technol., 43, 86 (July 2000).
11. T. P. Moffat, D. Wheeler, W. H. Huber, and D. Josell, Electrochem. Solid-State Lett., 4, C26 (2001).
12. A. C. West, S. Mayer, and J. Reid, Electrochem. Solid-State Lett., 4, C50 (2001).
13. Y. H. Im, M. O. Bloomfield, S. Sen, and T. S. Cale, Electrochem. Solid-State Lett., 6, C42 (2003).
14. D. M. Soares, S. Wasle, K. G. Weil, and K. Doblhofer, J. Electroanal. Chem., 532, 353 (2002).
15. H. P. Lee and K. Nobe, J. Electrochem. Soc., 133, 2035 (1986).
16. F. K. Crundwell, Electrochim. Acta, 37, 2707 (1992).
17. G. G. Láng, M. Ujvári, and G. Horányi, J. Electroanal. Chem., 522, 179 (2002).
18. Z. Nagy, J. P. Blaudeau, N. C. Hung, L. A. Curtiss, and D. J. Zurawski, J. Electrochem. Soc., 142, L87 (1995).
19. L. Bonou, M. Eyraud, R. Denoyel, and Y. Massiani, Electrochim. Acta, 47, 4139 (2002).
20. W. L. Li, J. H. Ye, and S. F. Y. Li, J. Appl. Electrochem., 31, 1395 (2001).
21. S.-C. Chang, J.-M. Shieh, K.-C. Lin, B.-T. Dai, T.-C. Wang, C.-F. Chen, M.-S. Feng, Y.-H. Li, and C.-P. Lu, J. Vac. Sci. Technol. B, 20, 1311 (2002).
22. M. Hayase, M. Taketani, K. Aizawa, T. Hatsuzawa, and K. Hayabusa, Electrochem. Solid-State Lett., 5, C98 (2002).
23. N. Zukauskaite and A. Malinauskas, Sov. Electrochem., 24, 1564 (1989).
24. J. P. Healy, D. Pletcher, and M. Goodenough, J. Electroanal. Chem., 338, 167 (1992).
25. J. Reid, C. Gack, and S. J. Hearne, Electrochem. Solid-State Lett., 6, C26 (2003).