Void-free anisotropic deposition for IC interconnect with polyethylene glycol as the single additive based on uneven adsorption distribution

Journal of Applied Electrochemistry

Volumn 33, Issue 9, 2003, Pages 823-830

  Wu, B H ^a   Wan, C C ^a   Wang, Y Y ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Adsorption; Adsorption isotherm; Copper interconnection; Current potential hysteresis; Polyethylene glycol; Superfilling

Indexed keywords

ACIDS; ADSORPTION; CHLORINE COMPOUNDS; CYCLIC VOLTAMMETRY; ELECTRIC CURRENT MEASUREMENT; ELECTROCHEMISTRY; ELECTROLYTES; ELECTRON TRANSPORT PROPERTIES; FREE ENERGY; HYSTERESIS; ISOTHERMS; POLYETHYLENE GLYCOLS;

ACID COPPER ELECTROLYTE; CHRONOPOTENTIOMETRY; CURRENT POTENTIAL HYSTERESIS; ELECTROCHEMICAL IMPEDANCE; LINEAR SWEEP VOLTAMMETRY; VOID FREE ANISOTROPIC DEPOSITION;

DEPOSITION;

EID: 0141741735     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1025550725883     Document Type: Article

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