A poly(dimethylsiloxane)-coated flexible mold for nanoimprint lithography

Nanotechnology

Volumn 18, Issue 41, 2007, Pages

  Lee, Nae Yoon ^a   Kim, Youn Sang ^b  

^a Gachon University College of Medicine   (South Korea)

^b Ewha Womans University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

NANOIMPRINT LITHOGRAPHY; POLYDIMETHYLSILOXANE; VISCOSITY;

ANTI-ADHESION PROPERTY; CONFORMAL CONTACT; ULTRAVIOLET-CURABLE PREPOLYMER;

MOLDS;

DIMETICONE;

ARTICLE; PRIORITY JOURNAL; ROOM TEMPERATURE; SURFACE PROPERTY; VISCOSITY;

LITHOGRAPHY; MOLDS; VISCOSITY;

EID: 34748901159     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/18/41/415303     Document Type: Article

References (41)

1. Jung G-Y, Li Z, Wu W, Ganapathiappan S, Li X, Olynick D L, Wang S Y, Tong W M and Williams R S 2005 Langmuir 21 6127
2. Taniguchi J, Kawasaki T, Tokano Y, Kogo Y, Miyamoto I, Komuro M, Hiroshima H, Sakai N and Tada K 2002 Japan. J. Appl. Phys. 41 4194
3. Maboudian R, Ashurst W R and Carraro C 2000 Sensors Actuators 82 219
4. Bailey T, Choi B J, Colburn M, Meissl M, Shaya S, Ekerdt J G, Sreenivasan S V and Willson C G 2000 J. Vac. Sci. Technol. B 18 3572
5. Bailey T, Smith B, Choi B J, Colburn M, Meissl M, Sreenivasan S V, Ekerdt J G and Willson C G 2001 J. Vac. Sci. Technol. B 19 2806
6. Lee H and Jung G-Y 2004 Japan. J. Appl. Phys. 43 8369
7. Jaszewski R W, Schift H, Gröning P and Margaritondo G 1997 Microelectron. Eng. 35 381
8. Alkaisi M M, Blaikie R J and McNab S J 2001 Microelectron. Eng. 57/58 367
9. Taniguchi J, Tokano Y, Miyamoto I, Komuro M and Hiroshima H 2002 Nanotechnology 13 592
10. Komuro M, Tokano Y, Taniguchi J, Kawasaki T, Miyamoto I and Hiroshima H 2002 Japan. J. Appl. Phys. 41 4182
11. Yu Z and Chou S Y 2004 Nano Lett. 4 341
12. Lee M J, Lee N Y, Lim J R, Kim J B, Kim M, Baik H K and Kim Y S 2006 Adv. Mater. 18 3115
13. Choi S-J, Yoo P J, Baek S J, Kim T W and Lee H H 2004 J. Am. Chem. Soc. 126 7744
14. Mori K, Sasaki Y, Hirahara H and Oishi Y 2003 J. Appl. Polym. Sci. 90 2549
15. Thanawala S K and Chaudhury M K 2000 Langmuir 16 1256
16. Chou S Y, Krauss P R and Renstrom P J 1995 Appl. Phys. Lett. 67 3114
17. Chou S Y, Krauss P R and Renstrom P J 1996 Science 272 85
18. Chou S Y, Krauss P R and Renstrom P J 1996 J. Vac. Sci. Technol. B 14 4129
19. Chou S Y and Krauss P R 1997 Microelectron. Eng. 35 237
20. Chou S Y, Krauss P R, Zhang W, Guo L and Zhuang L 1997 J. Vac. Sci. Technol. B 15 2897
21. Bender M, Otto M, Hadam B, Vratzov B, Spangenberg B and Kurz H 2000 Microelectron. Eng. 53 233
22. Kurashima Y, Komuro M, Hiroshima H, Taniguchi J and Miyamoto I 2003 Japan. J. Appl. Phys. 42 3871
23. Vratzov B, Fuchs A, Lemme M, Henschel W and Kurz H 2003 J. Vac. Sci. Technol. B 21 2760
24. Kim S H, Hiroshima H and Komuro M 2006 Nanotechnology 17 2219
25. Lee H and Jung G-Y 2005 Microelectron. Eng. 77 42
26. Hoff J D, Cheng L-J, Meyhöfer E, Guo L J and Hunt A J 2004 Nano Lett. 4 853
27. Guo L J 2007 Adv. Mater. 19 495
28. Guo L J, Cheng X and Chou C-F 2004 Nano Lett. 4 69
29. McAlpine M C, Friedman R S and Lieber C M 2003 Nano Lett. 3 443
30. Maury P, Péter M, Mahalingam V, Reinhoudt D N and Huskens J 2005 Adv. Funct. Mater. 15 451
31. Chao C-Y and Guo L J 2002 J. Vac. Sci. Technol. B 20 2862
32. Khang D-Y and Lee H H 2000 Appl. Phys. Lett. 76 870
33. Bogdanski N, Wissen M, Ziegler A and Scheer H-C 2005 Microelectron. Eng. 78/79 598
34. Yoon H, Lee K M, Khang D-Y and Lee H H 2004 Appl. Phys. Lett. 85 1793
35. Kim Y S, Lee N Y, Lim J R, Lee M J and Park S 2005 Chem. Mater. 17 5867
36. Park J, Kim Y S and Hammond P T 2005 Nano Lett. 5 1347
37. Lu Y, Chen X, Hu W, Lu N, Sun J and Shen J 2007 Langmuir 23 3254
38. Colthup N B, Daly L H and Wiberley S E 1990 Introduction to Infrared and Raman Spectroscopy 3rd edn (San Diego, CA: Academic) pp 360-361
39. Mateo C et al 2003 Biomacromolecules 4 772
40. Rowland H D, Sun A C, Schunk P R and King W P 2005 J. Micromech. Microeng. 15 2414
41. Lee H-J, Ro H W, Soles C L, Jones R L, Lin E K and Wu W-I 2005 J. Vac. Sci. Technol. B 23 3023