Temperature-reduced nanoimprint lithography for thin and uniform residual layers

Microelectronic Engineering

Volumn 78-79, Issue 1-4, 2005, Pages 598-604

  Bogdanski, N ^a   Wissen, M ^a   Ziegler, A ^a   Scheer, H C ^a  

^a UNIVERSITY OF WUPPERTAL   (Germany)

Author keywords

Hot embossing; Nanoimprint; Partial cavity filling; Squeezed flow; Thin residual layer

Indexed keywords

LITHOGRAPHY; MICROELECTROMECHANICAL DEVICES; POLYMERS; POLYSTYRENES; STRUCTURAL ANALYSIS; VISCOSITY;

HOT EMBOSSING; NANOIMPRINTING; SQUEEZED FLOW; THIN RESIDUAL LAYERS;

NANOTECHNOLOGY;

EID: 14944340239     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.12.076     Document Type: Conference Paper

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