Bonding techniques for hybrid active pixel sensors (HAPS)

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 574, Issue 2, 2007, Pages 392-400

  Bigas, M ^a   Cabruja, E ^a   Lozano, M ^a  

^a INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

Author keywords

2D packaging; 3D packaging; Bumping; Flip chip; Hybrid active pixel sensors (HAPS); Solder bumps

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; PIXELS; READOUT SYSTEMS;

2D PACKAGING; 3D PACKAGING; BUMPING; HYBRID ACTIVE PIXEL SENSORS (HAPS); SOLDER BUMPS;

HYBRID SENSORS;

EID: 34047207214     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nima.2007.01.176     Document Type: Review

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