Technology for very dense hybrid detector arrays using electroplated indium solderbumps

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 1, 2003, Pages 60-64

  Merken, Patrick ^a   John, Joachim ^b   Zimmermann, Lars ^c   Van Hoof, Chris ^c  

^a ROYAL MILITARY ACADEMY   (Belgium)

^b IMEC   (Belgium)

^c UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Electroplating; Flip chip; Hybrid detector arrays; Hybrid integration; Indium solderbumps; Photovoltaic infrared detectors; Silicon postprocessing

Indexed keywords

ELECTROPLATING; FLIP CHIP DEVICES; INFRARED DETECTORS; MICROELECTRONIC PROCESSING; PHOTOVOLTAIC EFFECTS; SEMICONDUCTING INDIUM; SEMICONDUCTING SILICON;

ELECTROPLATED INDIUM SOLDERBUMPS; HYBRID DETECTOR ARRAYS; SILICON POSTPROCESSING; SILICON READOUT ELECTRONICS;

HYBRID INTEGRATED CIRCUITS;

EID: 0037604511     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.811550     Document Type: Article

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