Bump & assembly technologies for sub-100 micron pitch flip chip

Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002

Volumn , Issue , 2002, Pages 276-279

  Bauer, C E ^a   Jain, Wu Fei ^b   Taran, A ^c  

^a TechLead Corp   (United States)

^b Plating Technology Development Department   (Taiwan)

^c Microelectronic Assembly Innovations   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COST REDUCTION; ELECTRONICS PACKAGING; GOLD; LIQUID CRYSTAL DISPLAYS; MICROELECTRONICS; SUBSTRATES; TRANSMISSION CONTROL PROTOCOL;

ALTERNATIVE SOLUTIONS; FINE-PITCH FLIP CHIP; HIGH DENSITY INTERCONNECTS; INTEGRATED ELECTRONICS; LIQUID CRYSTAL DISPLAY DRIVERS; MICROELECTRONICS ASSEMBLY; PERFORMANCE ENHANCEMENTS; TAPE CARRIER PACKAGE;

FLIP CHIP DEVICES;

EID: 84964612426     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2002.1185682     Document Type: Conference Paper

References (0)