A MCM-D-type module for the ATLAS pixel detector

IEEE Transactions on Nuclear Science

Volumn 46, Issue 6 PART 2, 1999, Pages 1861-1864

  Becks, K H ^a   Beyne, E ^b   Ehrmann, O ^c   Gerlach, P ^a   Gregor, I M ^a   Pieters, P ^b   Topper, M ^c   Truzzi, C ^b   Wolf, J ^c  

^a UNIVERSITY OF WUPPERTAL   (Germany)

^b IMEC   (Belgium)

^c FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIODES; INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; OPTICAL DEVICES; RADIATION DETECTORS; TRANSCEIVERS;

HYBRID PIXEL DETECTORS; LOCAL SIGNAL INTERCONNECTION BUSSES; OPTICAL TRANSCEIVER; POWER DISTRIBUTION BUSSES; SENSOR DIODES; TRACKING DETECTOR SYSTEM;

MULTICHIP MODULES;

EID: 0033349747     PISSN: 00189499     EISSN: None     Source Type: Journal    
DOI: 10.1109/23.819241     Document Type: Article

References (4)

1. K.-H. Becks et al., "A Multi-Chip Module, the Basic Building Block for Large Area Pixel Detectors", Proc. of IEEE Multi-Chip Module Conference (1996) 16.
2. DELPHI Collaboration, CERN/LEPC-92-12 (1992).
3. M. Pecht, Integrated Circuit, Hybrid, and Multi-chip Module Package Design Guidelines -A Focus on Reliability, J. Wiley & Sons (1994).
4. J.E. Morris, Electronics Packaging Forum Multi-chip Module Technology Issues, IEEE Press (1994).