Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM)

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 25, Issue 3, 2002, Pages 193-202

  Jang, Se Young ^a   Wolf, Juergen ^c   Ehrmann, Oswin ^c   Gloor, Heinz ^d   Reichl, Herbert ^c   Paik, Kyung Wook ^b  

^a SAMSUNG Electronics   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^c FRAUNHOFER IZM   (Germany)

^d Unaxis Furstentum ^*  (Germany)

Author keywords

Electroplating; Eutectic Pb Sn; Eutectic Sn Ag; Flip chip interconnection; Pb free solder; UBM

Indexed keywords

CHROMIUM ALLOYS; COPPER; ELECTROPLATING; FLIP CHIP DEVICES; INTERFACES (MATERIALS); INTERMETALLICS; LEAD ALLOYS; METALLIZING; NICKEL; SOLDERING ALLOYS; TIN ALLOYS; TITANIUM ALLOYS;

ELECTROPLATING BUMPING PROCESS; FLIP-CHIP INTERCONNECTION; LEAD-FREE SOLDER; UNDER BUMP METALLIZATION;

ELECTRONICS PACKAGING;

EID: 0036665742     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2002.801647     Document Type: Article

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