Development of an Indium bump bond process for silicon pixel detectors at PSI

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 565, Issue 1, 2006, Pages 303-308

  Broennimann, Ch ^a   Glaus, F ^a   Gobrecht, J ^a   Heising, S ^a   Horisberger, M ^a   Horisberger, R ^a   Kastli H C ^a   Lehmann, J ^a   Rohe, T ^a   Streuli, S ^b  

^a PAUL SCHERRER INSTITUTE   (Switzerland)

^b ETH ZURICH   (Switzerland)

Author keywords

Bump bonding; CMS; Indium; Interconnection; LHC; Pixels; Tracking

Indexed keywords

ADHESION; DEPOSITION; HIGH ENERGY PHYSICS; PHOTOLITHOGRAPHY; RESEARCH AND DEVELOPMENT MANAGEMENT; SILICON SENSORS; STANDARDS;

BUMP BONDING; CMS; HYBRID PIXEL DETECTORS; INTERCONNECTION; LHC; PIXELS; TRACKING;

PARTICLE DETECTORS;

EID: 33747183911     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nima.2006.05.011     Document Type: Article

References (7)

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