Performance of the stud bump bonding (SBB) process in comparison to solder flip chip technology

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 136-140

  Reinert, W ^a   Harder, T ^a  

^a FRAUNHOFER INSTITUTE FOR SILICON TECHNOLOGY ISIT   (Germany)

Author keywords

Assembly; Bonding processes; Conductive adhesives; Flip chip; Gold; Independent component analysis; Metallization; Packaging; Production; Wafer bonding

Indexed keywords

ADHESIVES; ASSEMBLY; BONDING; CHIP SCALE PACKAGES; COATINGS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; GOLD; INDEPENDENT COMPONENT ANALYSIS; JOINING; MANUFACTURE; METALLIZING; PACKAGING; PRODUCTION; STUDS (FASTENERS); STUDS (STRUCTURAL MEMBERS);

BONDING PROCESS; CONDUCTIVE ADHESIVE; ELECTRICAL INTERCONNECTIONS; FLIP CHIP; FLIP CHIP TECHNOLOGIES; ISOTROPICALLY CONDUCTIVE ADHESIVES; RELIABILITY EVALUATION; UNDER BUMP METALLIZATION;

WAFER BONDING;

EID: 4644231849     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860587     Document Type: Conference Paper

References (3)

1. H. Reichl (ed.) 'Direktmontage - Handbuch über die Verarbeitung ungehäuster ICs', Springer Verlag (1998)
2. K. Higashi et al. 'Development of Conductive Stud Bump Technology for the Best Shape Design and Control' Pan Pacific Microelectronic Symposium 1998, Hawaii, p. 449
3. D. Andresen Diploma Thesis: Preparation und Characterization of Flip Chip on Board Assemblies, Fraunhofer ISIT, Itzehoe (1999)