Comparison of a Cu-UBM versus Co-UBM for Sn flip chip bumps

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 449-451

  Labie, Riet ^a   Ratchev, Petar ^a   Beyne, Eric ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COBALT; DUCTILITY; FRACTURE; RELIABILITY; SOLDERING ALLOYS; TIN;

DUCTILE SHEAR; FLIP CHIP BUMPS; INTERMETALLIC INTERFACE; SN BUMPS;

FLIP CHIP DEVICES;

EID: 24644500113     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Riet Labie et al., "Investigation of Co UBM for direct bumping on Cu/low k dies", Proceedings of the 53rd ECTC Conference 2003, pp. 1230-1234
2. th EPIC Conference 2003
3. th EPTC Conference 2004
4. R. Chromik et al., "Nanoindentation measurements on Cu-Sn and Ag-Sn intermetallics formed in Pb free solder joints", J.Mater.Res., Vol9, 2003, pp 2251-2261