Study of indium and solder bumps for the BTeV pixel detector

IEEE Nuclear Science Symposium Conference Record

Volumn 1, Issue , 2003, Pages 59-62

  Kwan, S ^a   Andresen, J ^a   Appel, J A ^a   Cardoso, G ^a   Christian, D C ^a   Cihangir, S ^a   Kendziora, C ^a   Marinelli, M ^a   Ruschman, M ^a   Turqueti, M ^a   Wong, M L ^a   Zimmermann, S ^a  

^a FERMI NATIONAL ACCELERATOR LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYOGENICS; INDIUM; IRRADIATION; MICROPROCESSOR CHIPS; SOLDERING; THERMAL CYCLING; THERMAL EFFECTS; THERMAL EXPANSION;

BTEV PIXEL DETECTORS; FERMILAB TEVTRON; SILICON GLASS MODULES; SOLDER BUMPS;

SILICON SENSORS;

EID: 19944426637     PISSN: 10957863     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/nssmic.2003.1351998     Document Type: Conference Paper

References (7)

1. S. Cihangir and S. Kwan, "Characterization of indium and solder bump bonding for pixel detector," Nucl. Instrum. Methods. Vol. A476, pp. 670 (2002)
2. S. Kwan, J. A. Appel, D. Christian, G. Chiodini, S. Cihangir, F. Reygadas, and C. Newsom, "A Study of thermal cycling and radiation effects on indium and solder bump bonds," Proc. of IEEE NSS2001.
3. T. Rohe, F.G. Hugging, G. Lutz, R. H. Richter, and R. Wunstorf, "Sensor design for the ATLAS pixel detector", Nucl. Instrum. Methods, vol. A 409, pp. 224 (1998).
4. D. C. Christian, J. A. Appel, G. Cancelo, S. W. Kwan, J. Hoff, A. Mekkaoui, et. Al, "Development of a pixel read out chip for BTeV," Nucl. Instrum. Methods, vol. A 335, pp. 144 (1999).
5. G. Cardoso, J. Andresen, J.A.Appel D.C. Christian, G. Chiodini, B. K. Hall, S. Kwan, M. turqueti, and S. Zimmermann, "Pixel multichip module design for a high energy physics experiment", these proceedings.
6. M.R. Coluccia, J.A.Appel, G. Chiodini, D.C. Christian and S.W. Kwan, "Characterization of prototype BTeV silicon pixel sensors before and after irradiation," IEEE Trans. Nucl., Sci, vol. 49, no. 4, pp.1743-1749, 2002.
7. M.Turqueti, J.A.Appel, G. Cardoso, D.C. Christian, S. Cihangir, B. K. Hall, S. Kwan, and S. Zimmermann, "Temperature dependence of pixel multichip module operating performance", these proceedings.