Process development of a flip chip in package with Anisotropic Conductive Film (ACF) for lead-free soldering

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 450-454

  Siang, Sharon Lim Pei ^a   Min, Tan Ai ^a   Lee, Charles ^a  

^a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; ATMOSPHERIC HUMIDITY; FLIP CHIP DEVICES; MOISTURE; SOLDERING; THERMAL CYCLING;

ANISOTROPIC CONDUCTIVE FILM (ACF); DESIGN OF EXPERIMENT (DOE); I/O APPLICATIONS; MOISTURE SENSITIVITY LEVEL (MSL);

ELECTRONICS PACKAGING;

EID: 28444492701     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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10. JEDEC Standard, J-STD-020B, Moisture/Reflow Sensitivity classification for Nonhermatic Solid State Surface Mount Devices, July 2002
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