A new bumping process using lead-free solder paste

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 25, Issue 4, 2002, Pages 253-256

  Suga, Tadatomo ^a   Saito, Keisuke ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

Flux residues; Hydrogen radicals; Lead free solder bumping; Surface oxides

Indexed keywords

ADHESIVE PASTES; AUGER ELECTRON SPECTROSCOPY; FREE RADICALS; HYDROGEN; OXIDES; PLASMA APPLICATIONS; PRESSURE; PRINTING; SOLDERING ALLOYS; TIN ALLOYS;

FLUX RESIDUES; HYDROGEN RADICALS; LEAD-FREE SOLDER BUMPING; LEAD-FREE SOLDER PASTE; SURFACE OXIDES;

ELECTRONICS PACKAGING;

EID: 0036826608     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2002.807724     Document Type: Article

References (6)

1. K. Pickering et al., "Hydrogen plasmas for flux free flip-chip solder bonding," J. Vacuum Sci. Tech., vol. A8, no. 3, May-June 1990.
2. S. Hong et al., "Fluxless solder bumping in flip chip package by plasma reflow," in Proc. Int. Symp. Electron. Mater. Packag., 2002.
3. Challenge and Effort toward Commercialization of Lead-Free Solder Ver 1.3, JEIDA, 2000.
4. J. F. Kuhmann, "Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn. A knowledge base for fluxless solder bonding applications," in Proc. Electron. Comp. Technol. Conf. (ECTC'97), 1997.
5. K. Shinkai, "Plasma reflow machine" (in Japanese), in Electronics Components, 2001.
6. T. Osawa, The Basics and Applications of Soldering (in Japanese).