Bump bonding of pixel systems

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 473, Issue 1-2, 2001, Pages 95-101

  Lozano, M ^a   Cabruja, E ^a   Collado, A ^a   Santander, J ^a   Ullan M ^a  

^a UNIVERSITAT AUTÒNOMA DE BARCELONA   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; SEMICONDUCTING SILICON; SEMICONDUCTOR DIODES;

PIXEL SYSTEMS;

RADIATION DETECTORS;

EID: 0035500705     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-9002(01)01127-5     Document Type: Conference Paper

References (21)

1. Lead-free soldering - Where the world is going
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4. The optimization and characterization of ultra-thick photoresist films
5. Thermal behaviour analysis of an mcm-d technology