Experiences in flip chip production of radiation detectors

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 565, Issue 1, 2006, Pages 314-319

  Savolainen Pulli, Satu ^a   Salonen, Jaakko ^a   Salmi, Jorma ^a   Vähänen, Sami ^a  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

Flip chip; Pixel detector; Solder bump; Yield

Indexed keywords

IMAGING SYSTEMS; OPTICAL RESOLVING POWER; OPTIMIZATION; RADIATION DETECTORS; SILICON WAFERS; SOLDERING ALLOYS;

DEVICE DESIGN; PIXEL DETECTOR; PROCESS PLANNING; SOLDER BUMP;

FLIP CHIP DEVICES;

EID: 33747401967     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nima.2006.04.090     Document Type: Article

References (11)

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