Multi-stack silicon-direct wafer bonding for 3D MEMS manufacturing

Sensors and Actuators, A: Physical

Volumn 103, Issue 1-2, 2003, Pages 194-201

  Miki, N ^a   Zhang, X ^b   Khanna, R ^a   Ayon A A ^c   Ward, D ^a   Spearing, S M ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

^b BOSTON UNIVERSITY   (United States)

^c Sony Semiconductor   (United States)

Author keywords

3D structure; Multi stack wafer bonding; Silicon direct bonding; Wafer bonding

Indexed keywords

DEFECTS; FABRICATION; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; SOLDERING;

MULTI-STACK WAFER BONDING;

SILICON WAFERS;

EID: 0037438778     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(02)00332-1     Document Type: Conference Paper

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