Building pixel detector modules in multichip module deposited technology

IEEE Transactions on Nuclear Science

Volumn 52, Issue 6, 2005, Pages 3176-3180

  Becks, K H ^a   Flick, T ^a   Grah, C ^b   Gerlach, P ^a   Mattig P ^a  

^a UNIVERSITY OF WUPPERTAL   (Germany)

^b DESY   (Germany)

Author keywords

ATLAS; Bump bonding; Flip chip; Pixel detectors; Semiconductor detectors; Thin film technology

Indexed keywords

PROTON IRRADIATION; SENSORS;

MULTICHIP MODULE DEPOSITED TECHNOLOGY; OPTIMIZED SENSOR GEOMETRY; PIXEL DETECTOR MODULES;

MULTICHIP MODULES;

EID: 33144474283     PISSN: 00189499     EISSN: None     Source Type: Journal    
DOI: 10.1109/TNS.2005.862933     Document Type: Conference Paper

References (8)

1. ATLAS Pixel Detector Technical Design Report. The ATLAS collaboration, CERN/LHCC/98-13 ATLAS TDR 11.
2. K. H. Becks et al., "A MCM-D type module for the ATLAS pixel detector," presented at the IEEE Nuclear Science Symp., Toronto, ON, Canada, 1998.
3. C. Grah et al., "Pixel detector modules using MCM-D technology "Nucl. Instrum. Meth. A, vol. 465, pp. 211-218, 2001.
4. T. Flick, K. H. Becks, P. Gerlach, C. Grah, P. Mättig, and T. Rohe, "Studies on MCM-D pixel-detector-modules," Nucl. Phys. B, vol. 125, 2002.
5. K. H. Becks, T. Flick, P. Gerlach, C. Grah, and P. Mättig, "Studies on MCM-D interconnections," presented at the Int. Workshop on Semiconductor Pixel Detectors for Particles and X-Rays, 2002.
6. M. S. Alam et al., "The ATLAS silicon pixel sensors," Nucl. Instrum. Meth. A, vol. 456, pp. 217-232, 2001.
7. R. Wunstorf, "Radiation tolerant sensors for the ATLAS pixel detector," Nucl. Instrum. Meth. A, vol. 466, pp. 327-334, 2001.
8. A. Andreazza, "Performance of ATLAS pixel detector prototype modules," Nucl. Instrum. Meth. A, vol. 513, pp. 103-106, 2003.