Development of solder replacement flip chip using anisotropic conductive adhesives

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 390-396

  Min, Tan Ai ^a   Lim, S P S ^a   Lee, C ^a  

^a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANISOTROPY; CHIP SCALE PACKAGES; CONDUCTIVE FILMS; CURING; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; GOLD;

ANISOTROPIC CONDUCTIVE ADHESIVES; ANISOTROPIC CONDUCTIVE FILMS; ANISOTROPIC CONDUCTIVE PASTES; CONTACT RESISTANCE STABILITY; FINE-PITCH APPLICATION; FLIP CHIP ASSEMBLIES; INTERCONNECT TECHNOLOGY; TEMPERATURE HUMIDITY;

ADHESIVE JOINTS;

EID: 57949100873     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271552     Document Type: Conference Paper

References (13)

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