The impact of zincation on the electroless nickel UBM for low cost flip chip technology

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages 229-233

  Yang, Yu ^a   Cai, Jian ^a   Wang, Shuidi ^a   Jia, Songliang ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Electroless nickel plating; Low cost flip chip; Zincation

Indexed keywords

ADHESION; ALUMINUM ALLOYS; ELECTRIC RESISTANCE; NICKEL ALLOYS; SOLDERING; SURFACE ROUGHNESS; THIN FILMS;

ELECTROLESS NICKEL PLATING; LOW COST FLIP CHIP; SOLDER BUMPING; ZINCATION;

FLIP CHIP DEVICES;

EID: 33846324337     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564662     Document Type: Conference Paper

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