Wave soldering bumping process incorporating electroless nickel UBM

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 1, 2000, Pages 143-150

  Lin, Kwang Lung ^a   Chen, Jun Wen ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROLESS PLATING; FLIP CHIP DEVICES; HEAT TREATMENT; NICKEL PLATING; SILICON; SOLDERING; SOLDERING ALLOYS; SPUTTER DEPOSITION; TITANIUM;

SOLDER BUMPS; UNDER BUMP METALLURGY (UBM); WAVE SOLDERING;

ELECTRONICS PACKAGING;

EID: 0033871224     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.833053     Document Type: Article

References (9)

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