Ultra-thin film encapsulation processes for micro-electro-mechanical devices and systems

Journal of Physics D: Applied Physics

Volumn 39, Issue 9, 2006, Pages

  Stoldt, Conrad R ^a   Bright, Victor M ^a  

^a UCB 450   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CHEMICAL VAPOR DEPOSITION; ENCAPSULATION; SILICON CARBIDE; SOLID STATE DEVICE STRUCTURES; THIN FILMS; TRIBOLOGY; ZINC OXIDE;

ATOMIC LAYER DEPOSITION (ALD); MICROSCALE RELIABILITY; MICROSTRUCTURE ENCAPSULATION; ULTRA THIN COATINGS;

MICROELECTROMECHANICAL DEVICES;

EID: 33646402347     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/39/9/R01     Document Type: Review

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